Fumax Tech provides rapid and reliable turnkey Electronic Contract Manufacturing (EMS) services. Our complete turnkey service cover as everything from electronic engineering design of the circuits, PCB layout engineering, PCB fabrication of bare boards, component sourcing, parts procurement and final PCB assembly..
We have built our reputation of quality service in worldwide clients by offering various customize-product programs, substantial savings, right on time delivery and seamless communications.
The typical PCB assembly process are below.
• IQC
• automatic solder paste printing
• SPI
• SMT
• Reflow soldering
• AOI
• X-RAY (for BGA)
• ICT testing
• DIP through hole
• Wave soldering
• board cleaning
• Firmware Programming
• Function Testing
• coating (if needed)
• package
Our PCB assembly capability are shown below.
| Supported Capabilities | |
| Types of Assembly | SMT (Surface-Mount Technology) |
| THD (Thru-Hole Device) | |
| SMT & THD mixed | |
| Double sided SMT and THD assembly | |
| SMT capability | PCB layer: 1-32 layers; |
| PCB material: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum Boards; | |
| Board type: Rigid FR-4, Rigid-Flex boards | |
| PCB thickness: 0.2mm-7.0mm; | |
| PCB dimension width: 40-500mm; | |
| Copper thickness: Min:0.5oz; Max: 4.0oz; | |
| Chip accuracy: laser recognition ±0.05mm; image recognition ±0.03mm; | |
| Component size: 0.6*0.3mm-33.5*33.5mm; | |
| Component height: 6mm(max); | |
| Pin spacing laser recognition over 0.65mm; | |
| High resolution VCS 0.25mm; | |
| BGA spherical distance: ≥0.25mm; | |
| BGA Globe distance: ≥0.25mm; | |
| BGA ball diameter: ≥0.1mm; | |
| IC foot distance: ≥0.2mm; | |
| Component Package | Reels |
| Cut tape | |
| Tube and tray | |
| Loose parts and bulk | |
| Board shape | Rectangular |
| Round | |
| Slots and Cut outs | |
| Complex and Irregular | |
| Assembly process | Lead-Free (RoHS, REACH) |
| Design file format | Gerber |
| BOM (Bill of Materials) (.xls,.CSV, . xIsx) | |
| Coordination (Pick-N-Place/XY file) | |
| Electrical testing | AOI (Automated Optical Inspection), |
| X-ray Inspection | |
| ICT (In-Circuit Test)/ Functional testing | |
| Reflow Oven profile | Standard |
| Custom |
Request for Quote of PCB assembly:
Simply email your BOM files (Bill of Materials) and Gerber files to us at sales@fumax.net.cn, we will get back to you within 24 hours.
It is needed that BOM includes the quantities, reference designators, manufacturer name and manufacturer part number. Gerbers needs to include the PCB requirements.