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Fumax Tech offers top quality Printing Circuit Boards (PCB) including multi-layer PCB (printed circuit board), high-level HDI(high density inter-connector), arbitrary-layer PCB and rigid-flexible PCB…etc.

As a base material, Fumax understands the importance of reliable quality of the PCB. We invest in best equipments and talented team to produce best quality boards.

The typical PCB categories are below.

Rigid PCB

Flexible & Rigid Flex PCBs

HDI PCB

High Frequency PCB

High TG PCB

LED PCB

Metal core PCB

Thick Cooper PCB

Aluminum PCB

 

Our manufacturing capabilities are shown in the chart below.

Type

Capability

Scope

Multilayers(4-28)、HDI(4-20)Flex、Rigid Flex

Double Side

CEM-3、 FR-4、Rogers RO4233、Bergquist Thermal Clad 4mil–126mil (0.1mm-3.2mm)

Multilayers

4-28 layers, board thickness 8mil-126mil (0.2mm-3.2mm)

Buried/Blind Via

4-20 layers, board thickness 10mil-126mil(0.25mm-3.2mm)

HDI

1+N+1、2+N+2、3+N+3、Any layer

Flex & Rigid-Flex PCB

1-8layers Flex PCB ,2-12layers Rigid-flex PCB HDI+Rigid-flex PCB

Laminate

 

Soldermask Type(LPI)

Taiyo、Goo’s、Probimer FPC.....

Peelable Soldermask

 

Carbon ink

 

HASL/Lead Free HASL

Thickness: 0.5-40um

OSP

 

ENIG (Ni-Au)

 

Electro-bondable Ni-Au

 

Electro-nickel palladium Ni-Au

Au: 0.015-0.075um Pd 0.02-0.075um Ni:2-6umm

Electro. Hard Gold

 

Thick tin

 

Capability

Mass Production

Min Mechanical Drill Hole

0.20mm

Min. Laser Drill Hole

4mil (0.100mm)

Line Width/Spacing

2mil/2mil

Max. Panel Size

21.5" X 24.5"(546mm X 622mm)

Line Width/Spacing Tolerance

Non electro coating:+/-5um,Electro coating:+/-10um

PTH Hole Tolerance

+/-0.002inch(0.050mm)

NPTH Hole Tolerance

+/-0.002inch(0.050mm)

Hole Location Tolerance

+/-0.002inch(0.050mm)

Hole to Edge Tolerance

+/-0.004inch(0.100mm)

Edge to Edge Tolerance

+/-0.004inch(0.100mm)

Layer to Layer Tolerance

+/-0.003inch(0.075mm)

Impedance Tolerance

+/- 10%

Warpage %

Max≤0.5%

Technology (HDI Product)

ITEM

Production

Laser Via Drill/Pad

0.125/0.30 、 0.125/0.38

Blind Via Drill/Pad

0.25/0.50

Line Width/Spacing

0.10/0.10

Hole Formation

CO2 Laser Direct Drill

Build Up Material

FR4 LDP(LDD); RCC 50 ~100 micron

Cu Thickness on Hole Wall

Blind Hole: 10um(min)

Aspect Ratio

0.8 : 1

Technology (Flexible PCB)

Project 

Ability

Roll to roll (one side)

YES

Roll to roll (double)

NO

Volume to roll material width mm 

250

Minimum production size mm 

250x250 

Maximum production size mm 

500x500 

SMT Assembly patch (Yes/No)

YES

Air Gap capability (Yes/No)

YES

Production of hard and soft binding plate(Yes/No)

YES

Max layers(Hard)

10

Tallest layer(Soft plate)

6

Material Science 

 

PI

YES

PET

YES

Electrolytic copper

YES

Rolled Anneal Copper Foil

YES

PI

 

Covering film alignment tolerance mm

±0.1 

Minimum covering film  mm

0.175

Reinforcement 

 

PI

YES

FR-4

YES

SUS

YES

EMI SHIELDING

 

Silver Ink

YES

Silver Film

YES